3D Integration for VLSI Systems

3D Integration for VLSI Systems
Author: Chuan Seng Tan
Publisher: CRC Press
Total Pages: 376
Release: 2016-04-19
Genre: Science
ISBN: 9814303828
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Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th


3D Integration for VLSI Systems
Language: en
Pages: 376

3D Integration for VLSI Systems

Authors: Chuan Seng Tan
Categories: Science
Type: BOOK - Published: 2016-04-19 - Publisher: CRC Press

GET EBOOK

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling
3D Integration in VLSI Circuits
Language: en
Pages: 217

3D Integration in VLSI Circuits

Authors: Katsuyuki Sakuma
Categories: Technology & Engineering
Type: BOOK - Published: 2018-04-17 - Publisher: CRC Press

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Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D int
3D Integration in VLSI Circuits
Language: en
Pages: 217

3D Integration in VLSI Circuits

Authors: Katsuyuki Sakuma
Categories: Computers
Type: BOOK - Published: 2018 - Publisher: CRC Press

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Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D int
Design of 3D Integrated Circuits and Systems
Language: en
Pages: 302

Design of 3D Integrated Circuits and Systems

Authors: Rohit Sharma
Categories: Technology & Engineering
Type: BOOK - Published: 2018-09-03 - Publisher: CRC Press

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Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration req
3D Integration in VLSI Circuits
Language: en
Pages: 211

3D Integration in VLSI Circuits

Authors: Katsuyuki Sakuma
Categories: Technology & Engineering
Type: BOOK - Published: 2018-04-17 - Publisher: CRC Press

GET EBOOK

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D int