Area Array Package Design
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Area Array Package Design
| Author | : Ken Gilleo |
| Publisher | : McGraw-Hill Professional Publishing |
| Total Pages | : 232 |
| Release | : 2004 |
| Genre | : Technology & Engineering |
| ISBN | : |
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This engineering reference covers new techniques in electronic packaging - flip chip, BGA, and MEMs. It includes high density packaging and cleaning options.
