Area Array Packaging Handbook
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Area Array Packaging Handbook
Author | : Ken Gilleo |
Publisher | : McGraw Hill Professional |
Total Pages | : 832 |
Release | : 2002 |
Genre | : Business & Economics |
ISBN | : |
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*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
Area Array Packaging Handbook Related Books
Language: en
Pages: 832
Pages: 832
Type: BOOK - Published: 2002 - Publisher: McGraw Hill Professional
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (C
Language: en
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Pages: 276
Type: BOOK - Published: 2004 - Publisher: McGraw Hill Professional
This engineering reference covers the most important assembly processes in modern electronic packaging. It includes flip chip assembly and processes, die-attach
Language: en
Pages: 232
Pages: 232
Type: BOOK - Published: 2004 - Publisher: McGraw-Hill Professional Publishing
This engineering reference covers new techniques in electronic packaging - flip chip, BGA, and MEMs. It includes high density packaging and cleaning options.
Language: en
Pages: 1250
Pages: 1250
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third
Language: en
Pages: 182
Pages: 182
Type: BOOK - Published: 2004 - Publisher: McGraw Hill Professional
This engineering reference covers the most important assembly processes in modern electronic packaging.