Design And Reliability Of Solders And Solder Interconnections
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Design and Reliability of Solders and Solder Interconnections
Author | : Rao K. Mahidhara |
Publisher | : Minerals, Metals, & Materials Society |
Total Pages | : 468 |
Release | : 1997 |
Genre | : Technology & Engineering |
ISBN | : |
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The reliability of solders and solder joints is an important factor in the durability and design of electronic packages. This volume addresses issues of reliability such as microstructural stability in service, creep, fatigue, creep/fatigue interactions, and thermomechanical fatigue of bulk solders and solder joints.
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