Design and Reliability of Solders and Solder Interconnections

Design and Reliability of Solders and Solder Interconnections
Author: Rao K. Mahidhara
Publisher: Minerals, Metals, & Materials Society
Total Pages: 468
Release: 1997
Genre: Technology & Engineering
ISBN:

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The reliability of solders and solder joints is an important factor in the durability and design of electronic packages. This volume addresses issues of reliability such as microstructural stability in service, creep, fatigue, creep/fatigue interactions, and thermomechanical fatigue of bulk solders and solder joints.


Design and Reliability of Solders and Solder Interconnections
Language: en
Pages: 468
Authors: Rao K. Mahidhara
Categories: Technology & Engineering
Type: BOOK - Published: 1997 - Publisher: Minerals, Metals, & Materials Society

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The reliability of solders and solder joints is an important factor in the durability and design of electronic packages. This volume addresses issues of reliabi
Solder Joint Reliability
Language: en
Pages: 649
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2013-11-27 - Publisher: Springer Science & Business Media

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Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components.
Assembly and Reliability of Lead-Free Solder Joints
Language: en
Pages: 545
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2020-05-29 - Publisher: Springer Nature

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This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight place
Fundamentals of Lead-Free Solder Interconnect Technology
Language: en
Pages: 266
Authors: Tae-Kyu Lee
Categories: Technology & Engineering
Type: BOOK - Published: 2014-11-05 - Publisher: Springer

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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mech
Lead-Free Solder Interconnect Reliability
Language: en
Pages: 292
Authors: Dongkai Shangguan
Categories: Technology & Engineering
Type: BOOK - Published: 2005 - Publisher: ASM International

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