Designing Tsvs For 3d Integrated Circuits
Download Designing Tsvs For 3d Integrated Circuits full books in PDF, epub, and Kindle. Read online free Designing Tsvs For 3d Integrated Circuits ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Designing TSVs for 3D Integrated Circuits
Author | : Nauman Khan |
Publisher | : Springer Science & Business Media |
Total Pages | : 82 |
Release | : 2012-09-23 |
Genre | : Technology & Engineering |
ISBN | : 1461455073 |
Download Designing TSVs for 3D Integrated Circuits Book in PDF, Epub and Kindle
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.
Designing TSVs for 3D Integrated Circuits Related Books
Pages: 82
Pages: 573
Pages: 328
Pages: 260
Pages: 488