Interconnect Planning for Physical Design of 3D Integrated Circuits
Language: en
Pages: 138
Authors: Johann Knechtel
Categories: Three-dimensional integrated circuits
Type: BOOK - Published: 2014 - Publisher:

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Physical Design for 3D Integrated Circuits
Language: en
Pages: 409
Authors: Aida Todri-Sanial
Categories: Technology & Engineering
Type: BOOK - Published: 2017-12-19 - Publisher: CRC Press

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Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Language: en
Pages: 573
Authors: Sung Kyu Lim
Categories: Technology & Engineering
Type: BOOK - Published: 2012-11-27 - Publisher: Springer Science & Business Media

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This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimension
Handbook of 3D Integration, Volume 4
Language: en
Pages: 488
Authors: Paul D. Franzon
Categories: Technology & Engineering
Type: BOOK - Published: 2019-05-06 - Publisher: John Wiley & Sons

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This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate
Three Dimensional System Integration
Language: en
Pages: 251
Authors: Antonis Papanikolaou
Categories: Architecture
Type: BOOK - Published: 2010-12-07 - Publisher: Springer Science & Business Media

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Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as