Mechanics of Solder Alloy Interconnects

Mechanics of Solder Alloy Interconnects
Author: Darrel R. Frear
Publisher: Springer Science & Business Media
Total Pages: 434
Release: 1994-01-31
Genre: Computers
ISBN: 9780442015053
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The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.


Mechanics of Solder Alloy Interconnects
Language: en
Pages: 434

Mechanics of Solder Alloy Interconnects

Authors: Darrel R. Frear
Categories: Computers
Type: BOOK - Published: 1994-01-31 - Publisher: Springer Science & Business Media

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The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as
The Mechanics of Solder Alloy Interconnects
Language: en
Pages: 0

The Mechanics of Solder Alloy Interconnects

Authors:
Categories: Solder and soldering
Type: BOOK - Published: 1994 - Publisher:

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Fundamentals of Lead-Free Solder Interconnect Technology
Language: en
Pages: 266

Fundamentals of Lead-Free Solder Interconnect Technology

Authors: Tae-Kyu Lee
Categories: Technology & Engineering
Type: BOOK - Published: 2014-11-05 - Publisher: Springer

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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mech
The Mechanics of Solder Alloy Wetting and Spreading
Language: en
Pages: 367

The Mechanics of Solder Alloy Wetting and Spreading

Authors: Michael Hosking
Categories: Technology & Engineering
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

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In 1992 Congress passed the Defense Manufacturing Engineering Education Act with the intent of encouraging academic institutions to increase their emphasis on m
Continuum Damage Mechanics Based Failure Prediction Methodology for 95.5Sn-3.9Ag-0.6Cu Solder Alloy Interconnects in Electronic Packaging
Language: en
Pages: 806

Continuum Damage Mechanics Based Failure Prediction Methodology for 95.5Sn-3.9Ag-0.6Cu Solder Alloy Interconnects in Electronic Packaging

Authors: David Michael Pierce
Categories:
Type: BOOK - Published: 2007 - Publisher:

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