Microwave-measurement-based IC Interconnect Characterization, Modeling, and Simulation for High Speed VLSI Circuit Design

Microwave-measurement-based IC Interconnect Characterization, Modeling, and Simulation for High Speed VLSI Circuit Design
Author: Yungseon Eo
Publisher:
Total Pages: 460
Release: 1993
Genre:
ISBN:
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Microwave-measurement-based IC Interconnect Characterization, Modeling, and Simulation for High Speed VLSI Circuit Design
Language: en
Pages: 460

Microwave-measurement-based IC Interconnect Characterization, Modeling, and Simulation for High Speed VLSI Circuit Design

Authors: Yungseon Eo
Categories:
Type: BOOK - Published: 1993 - Publisher:

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Compact Models and Measurement Techniques for High-Speed Interconnects
Language: en
Pages: 81

Compact Models and Measurement Techniques for High-Speed Interconnects

Authors: Rohit Sharma
Categories: Technology & Engineering
Type: BOOK - Published: 2012-02-17 - Publisher: Springer Science & Business Media

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Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspec
On-Chip Inductance in High Speed Integrated Circuits
Language: en
Pages: 310

On-Chip Inductance in High Speed Integrated Circuits

Authors: Yehea I. Ismail
Categories: Technology & Engineering
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

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The appropriate interconnect model has changed several times over the past two decades due to the application of aggressive technology scaling. New, more accura
Advances in Monolithic Microwave Integrated Circuits for Wireless Systems: Modeling and Design Technologies
Language: en
Pages: 380

Advances in Monolithic Microwave Integrated Circuits for Wireless Systems: Modeling and Design Technologies

Authors: Marzuki, Arjuna
Categories: Technology & Engineering
Type: BOOK - Published: 2011-08-31 - Publisher: IGI Global

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Monolithic Microwave Integrated Circuit (MMIC) is an electronic device that is widely used in all high frequency wireless systems. In developing MMIC as a produ
Electrical Characterization and Circuit Modeling of Interconnections and Packages for High Speed Circuits by Time Domain Measurements
Language: en
Pages: 254

Electrical Characterization and Circuit Modeling of Interconnections and Packages for High Speed Circuits by Time Domain Measurements

Authors: Jyh-ming Jong
Categories: Digital electronics
Type: BOOK - Published: 1995 - Publisher:

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With edge rates of high speed digital devices pushing into the sub-nano second range, interconnections with the associated packages play a major role in determi