Modeling and Application of Flexible Electronics Packaging

Modeling and Application of Flexible Electronics Packaging
Author: YongAn Huang
Publisher: Springer
Total Pages: 287
Release: 2019-04-23
Genre: Technology & Engineering
ISBN: 981133627X

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This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.


Modeling and Application of Flexible Electronics Packaging
Language: en
Pages: 287
Authors: YongAn Huang
Categories: Technology & Engineering
Type: BOOK - Published: 2019-04-23 - Publisher: Springer

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This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes accor
Advanced Materials for Printed Flexible Electronics
Language: en
Pages: 641
Authors: Colin Tong
Categories: Technology & Engineering
Type: BOOK - Published: 2021-10-04 - Publisher: Springer Nature

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This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, pr
Manufacturing Challenges in Electronic Packaging
Language: en
Pages: 270
Authors: Y.C. Lee
Categories: Science
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

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About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands
Modeling and Simulation for Microelectronic Packaging Assembly
Language: en
Pages: 586
Authors: Shen Liu
Categories: Technology & Engineering
Type: BOOK - Published: 2011-05-17 - Publisher: John Wiley & Sons

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Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still ba
Power Electronic Packaging
Language: en
Pages: 606
Authors: Yong Liu
Categories: Technology & Engineering
Type: BOOK - Published: 2012-02-15 - Publisher: Springer Science & Business Media

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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic diffe