Semiconductor Wafer Bonding VII : Science, Technology, and Applications

Semiconductor Wafer Bonding VII : Science, Technology, and Applications
Author:
Publisher: The Electrochemical Society
Total Pages: 404
Release: 2003
Genre: Technology & Engineering
ISBN: 9781566774024

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Semiconductor Wafer Bonding VII : Science, Technology, and Applications
Language: en
Pages: 404
Authors:
Categories: Technology & Engineering
Type: BOOK - Published: 2003 - Publisher: The Electrochemical Society

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Semiconductor Wafer Bonding : Science, Technology, and Applications V
Language: en
Pages: 496
Authors: Charles E. Hunt
Categories: Technology & Engineering
Type: BOOK - Published: 2001 - Publisher: The Electrochemical Society

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Semiconductor Wafer Bonding VII : Science, Technology, and Applications
Language: en
Pages: 645
Authors:
Categories: Electronic apparatus and appliances
Type: BOOK - Published: 2003 - Publisher:

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Semiconductor Wafer Bonding 10: Science, Technology, and Applications
Language: en
Pages: 588
Authors:
Categories: Microelectromechanical systems
Type: BOOK - Published: 2008-10 - Publisher: The Electrochemical Society

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This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafe
Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele
Language: en
Pages: 656
Authors: C. Colinge
Categories: Science
Type: BOOK - Published: 2010-10 - Publisher: The Electrochemical Society

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Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such di