Solder Joint Technology

Solder Joint Technology
Author: King-Ning Tu
Publisher: Springer Science & Business Media
Total Pages: 376
Release: 2007-07-27
Genre: Technology & Engineering
ISBN: 0387388923

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The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.


Solder Joint Technology
Language: en
Pages: 376
Authors: King-Ning Tu
Categories: Technology & Engineering
Type: BOOK - Published: 2007-07-27 - Publisher: Springer Science & Business Media

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The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder jo
Solder Joint Reliability
Language: en
Pages: 649
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2013-11-27 - Publisher: Springer Science & Business Media

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Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components.
Modern Solder Technology for Competitive Electronics Manufacturing
Language: en
Pages: 680
Authors: Jennie S. Hwang
Categories: Technology & Engineering
Type: BOOK - Published: 1996 - Publisher: McGraw-Hill Professional Publishing

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Introduction Advanced Surface Mount Technology and Die Attach Techniques Solder Material Soldering Chemistry Solderability Microstructure of Solders Aqueous-Cle
Fundamentals of Lead-Free Solder Interconnect Technology
Language: en
Pages: 266
Authors: Tae-Kyu Lee
Categories: Technology & Engineering
Type: BOOK - Published: 2014-11-05 - Publisher: Springer

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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mech
Solder Paste in Electronics Packaging
Language: en
Pages: 374
Authors: Jennie Hwang
Categories: Technology & Engineering
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

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One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a repl