Thermal Analysis for Multiprocessor Systems of Three-dimensional Integrated Circuits

Thermal Analysis for Multiprocessor Systems of Three-dimensional Integrated Circuits
Author: 呂良盈
Publisher:
Total Pages: 119
Release: 2018
Genre:
ISBN:

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Thermal Analysis for Multiprocessor Systems of Three-dimensional Integrated Circuits
Language: en
Pages: 119
Authors: 呂良盈
Categories:
Type: BOOK - Published: 2018 - Publisher:

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Junction-Level Thermal Analysis of Three Dimensional Integrated Circuits
Language: en
Pages: 192
Authors: Samson Louis Benjamin Melamed
Categories:
Type: BOOK - Published: 2011 - Publisher:

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Three-Dimensional Integrated Circuit Design
Language: en
Pages: 770
Authors: Vasilis F. Pavlidis
Categories: Technology & Engineering
Type: BOOK - Published: 2017-07-04 - Publisher: Newnes

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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in cir
Design of 3D Integrated Circuits and Systems
Language: en
Pages: 328
Authors: Rohit Sharma
Categories: Technology & Engineering
Type: BOOK - Published: 2018-09-03 - Publisher: CRC Press

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Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration req
Analytical and Experimental Investigation of Thermal Transport in Three-dimensional Integrated Circuits (3D ICs)
Language: en
Pages: 156
Authors: Leila Choobineh
Categories: Fourier series
Type: BOOK - Published: 2014 - Publisher:

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Thermal management of three-dimensional integrated circuits (3D ICs) is recognized to be one of the foremost technological and research challenges currently blo