Thermal Performance and Reliability of Bonded Interfaces for Power Electronics Packaging Applications (Presentation).
Language: en
Pages: 23
Authors:
Categories:
Type: BOOK - Published: 2013 - Publisher:

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This presentation discusses the thermal performance and reliability of bonded interfaces for power electronics packaging applications.
Thermal Performance and Reliability of Bonded Interfaces for Power Electronics Packaging Applications (Presentation)
Language: en
Pages: 0
Authors:
Categories:
Type: BOOK - Published: 2013 - Publisher:

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This presentation discusses the thermal performance and reliability of bonded interfaces for power electronics packaging applications.
Thermal Performance and Reliability of Bonded Interfaces for Power Electronics Packaging Applications
Language: en
Pages: 23
Authors: Douglas DeVoto
Categories: Electronic packaging
Type: BOOK - Published: 2011 - Publisher:

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Performance and Reliability of Bonded Interfaces for High-Temperature Packaging (Presentation).
Language: en
Pages: 20
Authors:
Categories:
Type: BOOK - Published: 2014 - Publisher:

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The thermal performance and reliability of sintered-silver is being evaluated for power electronics packaging applications. This will be experimentally accompli
Performance and Reliability of Bonded Interfaces for High-temperature Packaging
Language: en
Pages: 21
Authors:
Categories: Accelerated life testing
Type: BOOK - Published: 2018 - Publisher:

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