Thermal Stress Analysis of Electronic Packaging Components
Language: en
Pages:
Authors: Chee Wai See Toh
Categories:
Type: BOOK - Published: 1998 - Publisher:

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Thermal Stress and Strain in Microelectronics Packaging
Language: en
Pages: 904
Authors: John Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

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Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the soluti
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Language: en
Pages: 305
Authors: Juan Cepeda-Rizo
Categories: Technology & Engineering
Type: BOOK - Published: 2021-12-29 - Publisher: CRC Press

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Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Explor
Thermal Stress Analysis of Electronic Packaging [microform]
Language: en
Pages: 210
Authors: Victor Aldea
Categories: Electronic packaging
Type: BOOK - Published: 2004 - Publisher: Library and Archives Canada = Bibliothèque et Archives Canada

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Advanced Materials for Thermal Management of Electronic Packaging
Language: en
Pages: 633
Authors: Xingcun Colin Tong
Categories: Technology & Engineering
Type: BOOK - Published: 2011-01-05 - Publisher: Springer Science & Business Media

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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic in