Thermal Stress Analysis of Electronic Packaging [microform]

Thermal Stress Analysis of Electronic Packaging [microform]
Author: Victor Aldea
Publisher: Library and Archives Canada = Bibliothèque et Archives Canada
Total Pages: 210
Release: 2004
Genre: Electronic packaging
ISBN: 9780612973985

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Thermal Stress Analysis of Electronic Packaging [microform]
Language: en
Pages: 210
Authors: Victor Aldea
Categories: Electronic packaging
Type: BOOK - Published: 2004 - Publisher: Library and Archives Canada = Bibliothèque et Archives Canada

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Thermal Stress and Strain in Microelectronics Packaging
Language: en
Pages: 904
Authors: John Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

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Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the soluti
Thermal Stress Analysis of Electronic Packaging Components
Language: en
Pages:
Authors: Chee Wai See Toh
Categories:
Type: BOOK - Published: 1998 - Publisher:

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Mechanical Analysis of Electronic Packaging Systems
Language: en
Pages: 382
Authors: Mckeown
Categories: Technology & Engineering
Type: BOOK - Published: 1999-04-06 - Publisher: CRC Press

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"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyz
Practical Guide to the Packaging of Electronics
Language: en
Pages: 226
Authors: Ali Jamnia
Categories: Technology & Engineering
Type: BOOK - Published: 2002-10-08 - Publisher: CRC Press

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Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reli