Continuum Damage Mechanics Based Failure Prediction Methodology For 955sn 39ag 06cu Solder Alloy Interconnects In Electronic Packaging
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Continuum Damage Mechanics Based Failure Prediction Methodology for 95.5Sn-3.9Ag-0.6Cu Solder Alloy Interconnects in Electronic Packaging
| Author | : David Michael Pierce |
| Publisher | : |
| Total Pages | : 806 |
| Release | : 2007 |
| Genre | : |
| ISBN | : |
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