Junction-Level Thermal Analysis of Three Dimensional Integrated Circuits

Junction-Level Thermal Analysis of Three Dimensional Integrated Circuits
Author: Samson Louis Benjamin Melamed
Publisher:
Total Pages: 192
Release: 2011
Genre:
ISBN:

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Junction-Level Thermal Analysis of Three Dimensional Integrated Circuits
Language: en
Pages: 192
Authors: Samson Louis Benjamin Melamed
Categories:
Type: BOOK - Published: 2011 - Publisher:

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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Language: en
Pages: 573
Authors: Sung Kyu Lim
Categories: Technology & Engineering
Type: BOOK - Published: 2012-11-27 - Publisher: Springer Science & Business Media

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This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimension
Three-Dimensional Integrated Circuit Design
Language: en
Pages: 292
Authors: Yuan Xie
Categories: Technology & Engineering
Type: BOOK - Published: 2009-12-02 - Publisher: Springer Science & Business Media

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We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law
Thermal Analysis for Multiprocessor Systems of Three-dimensional Integrated Circuits
Language: en
Pages: 119
Authors: 呂良盈
Categories:
Type: BOOK - Published: 2018 - Publisher:

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Design of 3D Integrated Circuits and Systems
Language: en
Pages: 328
Authors: Rohit Sharma
Categories: Technology & Engineering
Type: BOOK - Published: 2018-09-03 - Publisher: CRC Press

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Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration req