Reliability Of Next Generation Power Electronics Packaging Under Concurrent Vibration Thermal And High Power Loads
Download Reliability Of Next Generation Power Electronics Packaging Under Concurrent Vibration Thermal And High Power Loads full books in PDF, epub, and Kindle. Read online free Reliability Of Next Generation Power Electronics Packaging Under Concurrent Vibration Thermal And High Power Loads ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Reliability of Next Generation Power Electronics Packaging Under Concurrent Vibration, Thermal and High Power Loads
| Author | : |
| Publisher | : |
| Total Pages | : 273 |
| Release | : 2008 |
| Genre | : |
| ISBN | : |
Download Reliability of Next Generation Power Electronics Packaging Under Concurrent Vibration, Thermal and High Power Loads Book in PDF, Epub and Kindle
This final report presents a study on predicting reliability of next generation power electronics packaging, under high power loads. The study entails computational simulation modeling of power electronics packaging under high current density, high temperature gradient, high temperature and mechanical loads. Computer simulations are used for various scenarios to predict life time to failure and predictions are compared against actual experimental field data to validate the models.
