Solder Materials
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Solder Joint Technology
| Author | : King-Ning Tu |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 376 |
| Release | : 2007-07-27 |
| Genre | : Technology & Engineering |
| ISBN | : 0387388923 |
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The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
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