Thermal Stress and Fatigue Analysis of Microelectronic Packaging

Thermal Stress and Fatigue Analysis of Microelectronic Packaging
Author: Meng Leong Tan
Publisher:
Total Pages:
Release: 1998
Genre:
ISBN:
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Thermal Stress and Fatigue Analysis of Microelectronic Packaging
Language: en
Pages:

Thermal Stress and Fatigue Analysis of Microelectronic Packaging

Authors: Meng Leong Tan
Categories:
Type: BOOK - Published: 1998 - Publisher:

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Thermal Stress and Strain in Microelectronics Packaging
Language: en
Pages: 904

Thermal Stress and Strain in Microelectronics Packaging

Authors: John Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

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Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the soluti
Thermal Stress and Strain in Microelectronics Packaging
Language: en
Pages: 908

Thermal Stress and Strain in Microelectronics Packaging

Authors: John Lau
Categories:
Type: BOOK - Published: 1993-08-05 - Publisher:

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Practical Guide to the Packaging of Electronics
Language: en
Pages: 226

Practical Guide to the Packaging of Electronics

Authors: Ali Jamnia
Categories: Technology & Engineering
Type: BOOK - Published: 2002-10-08 - Publisher: CRC Press

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Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reli
Thermal Stress Analysis of Electronic Packaging [microform]
Language: en
Pages: 210

Thermal Stress Analysis of Electronic Packaging [microform]

Authors: Victor Aldea
Categories: Electronic packaging
Type: BOOK - Published: 2004 - Publisher: Library and Archives Canada = Bibliothèque et Archives Canada

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